Motherboard with Intel® Xeon® Ice lake-D HCC 2775TE, supporting 6x DDR4, 1x PCIe x8 connector for riser board, 3x 10GbE fiber, 10GbE Copper, 1GbE for IPMI, M.2 2280, eMMC
The IS-B135 based on Intel® Xeon® Ice Lake D 2775TE is a 200mm x 300mm motherboard designed for network service applications. With the feature of the wide operating temperature of Ice Lake D, AEWIN designs the motherboard to endure wide operating temperature of -20 to 75 degree C which make it suitable to operate under rugged environment with high reliability. IS-B135 supports up to six DDR4 2666 (2DPC)/2933 (1DPC) MHz UDIMM sockets with max capacity up to 192 GB. For the storage, it not only provides M.2 2280 for fast speed module, but also has additional eMMC and SATA pin header for the flexible configurations. Regarding the ethernet port, it supports 3x 10GbE SFP+, 10GbE Copper, and 1GbE Copper for IPMI. Furthermore, it has PCIe x8 connector for riser board to support the expansion module for additional function required. IS-B135 is also with TPM 2.0 to protect the system start-up without compromise the computing performance. In addition to the rich I/O and function mentioned, it supports DPDK for fast packet processing to accelerate the overall speed of the information forwarding for better efficiency.
Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.
If you disable this cookie, we will not be able to save your preferences. This means that every time you visit this website you will need to enable or disable cookies again.
This website uses Google Analytics to collect anonymous information such as the number of visitors to the site, and the most popular pages.
Keeping this cookie enabled helps us to improve our website.
Please enable Strictly Necessary Cookies first so that we can save your preferences!
This website uses the following additional cookies:
(List the cookies that you are using on the website here.)